Research

Parallel processing, modeling and simulation of high-speed interconnects, signal integrity, packaging, nonlinear circuits, multidisciplinary optimization, model-reduction techniques,
statistical analysis, wavelets and neural networks, opto-electronic systems, design centering, thermal design, electromagnetic radiation and interference.

Application

Design of RF and high-speed circuits and systems.

Activities

• Associate Editor of IEEE – Transactions on Advanced Packaging
• Member of the Executive Committee of the IEEE International Signal Propagation on Interconnects Workshop (SPI)
• Member of the Technical Program Committee of the IEEE International Microwave Symposium (IMS)
• Member of the Technical Program Committee of the IEEE Conference on Electrical Performance of Electronic Packaging (EPEPS)
• Member of the editorial board Research Letters on Electronics
• Member of the CAD committee (MTT-1) of the IEEE Microwave Theory and Techniques Society
• Member of Technical Program Committee of Frontiers in Analog Circuit (FAC) Synthesis and Verification Workshop (2011)
• Fellow IEEE

Journal Articles

D. Paul, Natalie N. Nakhla, R. Achar, M. Nakhla (2009), “Parallel Simulation of Massively Coupled Interconnect Networks”, IEEE Transactions Advanced Packaging (publication pending).

E. Gad, M. Nakhla, R. Achar, and Y. Zhou (2009), “A-Stable and L-Stable High-Order Integration Methods for Solving Stiff Differential Equations, IEEE Transactions on Computer-aided Design of Integrated Circuits and Systems (publication pending).

R. Achar, M.S. Nakhla, , N. Nakhla,  A.E. Ruehli, A.R. Sridhar (2009) , ”Fast EMI Analysis via Transverse Partitioning and Waveform Relaxation”, IEEE Transactions on Electromagnetic Compatibility (publication pending).

B. Nouri, R. Achar, M. Nakhla (2009), “z-Domain Orthonormal Basis Functions for Physical System Identification”, IEEE Transactions Advanced Packaging (publication pending).

C. Chen, D. Saraswat, R. Achar , E. Gad, Member, M. Nakhla, Fellow, M. C. E. Yagoub (2008), “Passivity Compensation Algorithm for Method-of-Characteristics Based Multiconductor Transmission Line Interconnect Macromodels”,  IEEE Transactions on Very Large Scale Integration (publication pending).

D. Paul, M. Nakhla, R.  Achar and Andreas Weisshaar, “Broadband Modeling of High-Frequency Microwave Devices,” IEEE Transactions on Microwave Theory and Techniques, Volume 57, Issue 2, pp. 361-373, February 2009.

P. Triverio, S.  Grivet-Talocia, M. Nakhla, “A Parameterized Macromodeling Strategy with Uniform Stability Test,” IEEE Transactions Advanced Packaging, Volume 32, Issue 1, pp. 205-215, February 2009.

G. Shinh, N. Nakhla, R. Achar, M. Nakhla, and I. Erdin, “Simplified Macromodel of MTLs With Incident Fields (SiMMIF)”, IEEE Transactions on Electromagnetic Compatibility,  Volume 50,  Issue 2, pp. 375 – 389,  May 2008.

C. Chen, D. Saraswat,  R. Achar, E. Gad, M. Nakhla, M. Yagoub, “A Robust Algorithm for Passive Reduced-Order Macromodeling of MTLs With FD-PUL Parameters Using Integrated Congruence Transform,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 27,  Issue 3,  574 – 578, March 2008.

P. Triverio, S.  Grivet-Talocia, M. Nakhla, F. Canavero and R. Achar, “Stability, causality, and passivity in electrical interconnect models,” IEEE Transactions on Advanced Packaging, Volume 30, Issue 4, pp. 795-808, November 2007 (IEEE Transactions Best Paper Award).

W. Tseng, C. Chen, E. Gad, M. Nakhla, and R. Achar, “Passive Order Reduction for RLC Circuits with Delay Elements,” IEEE Transactions on Advanced Packaging, Volume 30, Issue 4, pp. 830-840, November 2007.

A. Charest, D. Saraswat, M. Nakhla, R. Achar and N. Soveiko, “Compact Macromodeling of Long Delay Interconnects via Delayed Rational Functions”, IEEE Microwave and Wireless Components Letters,  Volume 17,  Issue 12, pp. 828 – 830, Dec. 2007.

N. Soveiko, E. Gad and M. Nakhla, “A Wavelet-Based Approach for Steady-State Analysis of Nonlinear Circuits with Widely Separated Time Scales,” IEEE Microwave and Wireless Components Letters, Volume 17, Issue 6, pp. 451-453, June 2007.

C. Chen, E. Gad, M. Nakhla and R. Achar, “Analysis of Frequency-Dependent Interconnects Using Integrated Congruence Transform”, IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems, Volume 26,Issue 6,  pp. 1139-1149, June 2007.

N. Nakhla, A. Ruehli, M. Nakhla, R. Achar and C. Chen, “Waveform Relaxation Techniques for Simulation of Coupled Interconnects with Frequency-Dependent Parameters”, IEEE Transactions on Advanced Packaging, Volume 30, Issue 2, pp. 257-269, May 2007.

C. Chen, E. Gad, M. Nakhla and R. Achar, “Passivity Verification in Delay-Based Macromodels for Multiconductor Electrical Interconnects,” IEEE Transactions on Advanced Packaging, Volume 30, Issue 2, pp. 246 – 256, May 2007.

D. Saraswat, R. Achar and M. Nakhla, “Fast Passivity Verification and Enforcement via Reciprocal Systems for Interconnects With Large Order Macromodels”, IEEE Transactions on Very Large Scale Integration, Volume 15, Issue 1, pp. 48-59, Jan. 2007.

Conference Publications

H.  Dhindsa, A. Sridhar, R. Achar, M. Nakhla and D. Paul, “Transient Analysis of Power Grid Networks via Waveform Relaxation Techniques,” IEEE MTT-S International Microwave Workshop, February 2009.

A. Charest, M. Nakhla, R. Achar, and C.  Chen , ” Passivity Verification and Enforcement of Delayed Rational Function Macromodels from Networks Characterized by Tabulated Data,” IEEE Workshop on Signal Propagation on Interconnects, May 2009.

P. Triverio, S. Grivet-Talocia, M. Nakhla, “On the Construction of Uniformly Stable Multivariate Interconnect Macromodels,” IEEE Workshop on Signal Propagation on Interconnects, May 2009.

R. Achar, M. Nakhla, A. Sridhar, H. Dhindsa, D. Paul, “Fast Analysis of Power Distribution Networks using Waveform Relaxation”, IEEE Workshop on Signal Propagation on Interconnects, May 2009.

D. Paul, N. Nakhla, R. Achar , M. Nakhla, “Coupled high-speed interconnect analysis on parallel platforms,” Electrical Design of Advanced Packaging and Systems Symposium (EDAPS), pp. 202-205, December 2008.

D. Paul, N. Nakhla, R. Achar , M. Nakhla, “Parallel algorithm for analysis of high-speed interconnects,” IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, pp. 191-194, October 2008.

P. Triverio, S. Grivet-Talocia, M. Nakhla, “An improved fitting algorithm for parametric macromodeling from tabulated data”, IEEE Workshop on Signal Propagation on Interconnects, Portofino, Italy, May 2008.

B. Nouri, R. Achar, M. Nakhla, D. Saraswat, “z-Domain Orthonormal Vector Fitting for Macromodeling High-Speed Modules Characterized by Tabulated Data,” IEEE Workshop on Signal Propagation on Interconnects, Portofino, Italy, May 2008.

R. Achar, A. Sridhar, N. Nakhla, M. Nakhla, “Parallel EMI analysis of large coupled interconnects via transverse partitioning and waveform relaxation”, International IEEE Symposium on Electromagnetic Compatibility, Zurich, Switzerland, May 2008.

C. Walkey, D. Paul, M. Nakhla and R. Achar, “A Novel Passivity Verification and Enforcement Algorithm for Macromodels of Microwave Devices,” IEEE International Microwave Symposium (IMS), June 2008.

N. Soveiko, M. Nakhla, R. Achar and E. Gad, “Scalable Parallel Matrix Solver for Steady State Analysis of Large Nonlinear Circuits, IEEE International Microwave Symposium (IMS), June 2008.

N. Nakhla, M. Nakhla and R. Achar, “Sparse and Passive Reduction of Massively Coupled Large Multiport Interconnects,” IEEE International Conference on Computer-Aided Design (ICCAD’07), San Jose, CA, Nov. 2007.

N. Nakhla, M. Nakhla, R. Achar and A. Ruehli, “Parallel Simulation of High-Speed Interconnects using Delay Extraction and Transverse Partitioning,” IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, Atlanta, GA, Oct. 2007.

A. Sridhar, N. Nakhla, R. Achar and M. Nakhla, “Fast EMC Analysis of High-speed Interconnects via Waveform Relaxation and Transverse Partitioning,” IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, Atlanta, GA, Oct. 2007.

A. Jerome, P. Gunupudi and M. Nakhla, “Efficient Parameterized Nonlinear Simulation of VLSI Circuits using Domain Decomposition Techniques,” IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, Atlanta, GA, Oct. 2007.

P. Triverio, M. Nakhla and S. Grivet-Talocia, “Parametric Macromodeling of Multiport Networks from Tabulated Data”, IEEE 16th Topical Meeting on Electrical Performance of Electronic Packaging, Atlanta, GA, Oct. 2007.

C. Walkey, D. Paul, M. Nakhla and R. Achar, “Efficient Passive Macromodelling of High-Speed Interconnects,” International Symposium on Signals, Systems and Electronics, pp. 275 – 278, July 2007.

C. Chen, D. Saraswat, R. Achar, E. Gad, M. Nakhla and. M. Yagoub, “Passivity Enforcement for Method of Characteristics-based Multiconductor Transmission Line Macromodels,” International Symposium on Signals, Systems and Electronics, pp.25 – 28, July 2007.